Principle of rf sputtering coating machine

Principle of rf sputtering coating machine

Exterior burnish products, in fact, most of them are used the surface treatment, and said to the surface treatment, now of the coating is one of the typical type of surface treatment. And this kind of surface treatment of the main characteristic is that after coating makes the product's surface is covered with a layer of thin film and have the function of the isolated from the outside factors influenc...e its surface. And the other is generally after coating, the surface has a certain iuster, for the products, improve the appeal. Now, use a lot of coating machinery, including the control sputtering coating machine, vacuum evaporation equipment, to introduce below the peak sputtering coating machine.
Vacuum coating machine in a vacuum chamber, applying frequency to set two plates and in more than 50 kh high-frequency electric, is a small amount of electrons in the high frequency electric field in the high frequency electric field under the action of accelerating, collide with gas molecules, make gas ionization and emitted electron, the electronic and high frequency electric field will be accelerated, eventually forming the high frequency glow discharge. Radio frequency glow discharge of glow there is no difference between the two electrodes, each with a cathode dark space and negative hui district, plasma column between the two poles. Input coupling mode of high frequency power supply mode with capacitive coupling and inductance coupling, which is currently an internal principle of splash control sputtering coating machine, also because this principle makes the sputtering coating machine to use stability.

How to reduce the vacuum coating of dust?

How to reduce the vacuum coating of dust?

Through long-term practice, summed up dust factors affecting the effect of vacuum evaporation coating machine coating and matters needing attention:
1. The coating after a period of time, the inner wall of the vacuum coating machine must be clean;
2. The staff have special clothing, light coating machine operation to wear gloves, socks, etc.;
3. Clean the substrate material, must be strictly accord with technical requirements;
4. Use the purity of source materials to meet the necessary requirements;
5. The sample out after placing environment to pay attention to the problem of clean;
6. The appropriate increase the humidity environment, multi arc ion coating machine can lower the suspended solid particles of the surrounding environment;
7. Technically explicitly allow maximum particle size and the number of particles per unit area of the ceiling is roughly how much;
8. The indoor air flow is low, the ground clean, splash control sputtering coating machine if it is a bare concrete, need to deal with the cover. Walls, roofs, cannot use the general grey coating paint.

Introduction to the vacuum plating equipment common vacuum coating method

Introduction to the vacuum plating equipment common vacuum coating method

Vacuum plating equipment is used for a class of need in the vacuum coating equipment, coating method is called vacuum coating method. Vacuum coating method is in the heart of the vacuum evaporating metals, alloys or compounds (or sputtering), make them deposited on the surface of the substrate, method. On the material surface plating a layer of thin film, can be material to... obtain some new chemical or physical properties. Vacuum coating method is a new coating process, also known as dry coating method, compared with the wet plating method, it has the features: 1, the film less susceptible to pollution, get good coating compactness, high purity. 2, wide range of membrane materials and the selection of base material, the film thickness can be controlled, with different vacuum plating equipment preparation of different functional thin film. 3, membrane layer and substrate adhesion, strong. 4, does not produce waste, not cause environmental pollution.
Common coating methods include vacuum evaporation, sputtering, ion plating, etc. These three coating methods have their advantages and disadvantages, including ion plating used most widely, its characteristic is: can plating materials including metals, alloys, compounds, such as membrane material evaporation method with evaporation and sputtering, membrane layer adherent strength is good, the plating film density high, uniform, can all plated surface.

Vacuum coating equipment choice points

Vacuum coating equipment choice points

▲ optional double water-cooled furnace body structure made of stainless steel, carbon steel, or combinations thereof of.
▲ resistive and inductive heating in the form of two kinds, resistance heating materials molybdenum wire (band), tungsten (band), a graphite rod (plate), tantalum rods, nickel chromium wire (with) several types according to different temperature and process requirements for selection.
▲ heat insulation layer metal and composite two, choose according to different process conditions.
▲ vacuum system consists of a mechanical pump, diffusion pump, oil booster, augmentations pumps, vacuum pumps, etc., and they are matched with a variety of pneumatic, manual, electric valves, piping, etc., can choose according to process requirements.
▲ temperature control system can choose different types of thermometer, temperature control and their sensing element.
▲ intelligent vacuum measurement optional digital vacuum gauge and measure the quality of regulation to ensure the accuracy of the degree of vacuum and product reliability.
▲ can be equipped with multi-point recorder for the whole process analysis, quality control and production management.
▲ According device characteristics, manual, semi-automatic, or a combination of control.
▲ according to the requirement with a variety of inflatable type, mass flowmeter, rotameter, to meet the inflation pressure controlled, multiple inflatable requirements.
▲ of water over-temperature, temperature deviation large, furnace, pumps, heat exchangers, etc., phase diffusion pump, furnace inflatable overvoltage, insufficient gas supply pressure, overcurrent and overvoltage, open circuit and other abnormal situations audible alarm and perform the appropriate protective measures.
▲ fast cooling system and the heat exchanger can choose natural cooling cycle mode, may be used for large-capacity electric furnace outer fast circulating cooling system to improve the cooling rate.

The development of the vacuum magnetron sputtering deposition

The development of the vacuum magnetron sputtering deposition
So-called sputtering can be in the charge particles (usually with positive ions of inert gas) to bombard solid surface (hereinafter referred to as the "target"), so as to cause the target material on the surface of the atoms or molecules to escape from it a phenomenon. This phenomenon is glover (Grove) in experimental study in 1842, the cathode corrosion problems, cathode materials have been migrated to the vacuum tube wall. Vacuum coating machine to use this method of sputter deposition film on the substrate was introduced in 1877. Using this approach, however, exist in the early stages of the deposition film sputtering rate is low, film speed is slow, and must be set on high pressure and the device into the inert gas and so on a series of problems. As a result, the slow development of nearly eliminated. Only in the strong chemical activity of precious metals, little metal, get a small amount of medium and compound material application. Until the 1970 s, with the advent of magnetron sputtering in a timely manner, making sputtering deposition has been rapid development, started to go the way of revival.
This is because the magnetron sputtering method by orthogonal electromagnetic field on electronic constraints, increased the probability of electrons collide with gas molecules, such not only reduced on the cathode voltage, and improve the positive ions on target cathode sputtering rate, reduce the probability of the electron bombardment substrate, thus reducing its temperature, namely with the "high speed, low temperature" two big characteristics. In the 80 s, although he appeared just ten years, it will stand out from the lab, truly entered the field of industrial production. And, with the further development of the science and technology, in recent years in the field of sputtering coating introduced ion beam enhanced sputtering, ion source using broad beam intensity flow combined with magnetic field modulation, and combined with the conventional diode sputtering formed a new sputtering mode. And, again will be introduced to the intermediate frequency ac power magnetron sputtering target source. This is called the twin sputtering targets intermediate frequency ac magnetron sputtering technology, not only eliminates the anode effect "disappear". And also solve the problem of cathode "poisoning", which greatly improved the stability of the magnetron sputtering. For large-scale industrialized production of the preparation of compound film provides a solid foundation. Revival and development of coating has rapidly in recent years as people quite a new preparation technology of thin film and active in the field of vacuum coating technology.

Vacuum coating equipment operation steps

Vacuum coating equipment operation steps

The operation of the vacuum coating equipment with reference to the equipment manual and vacuum coating machine each knob under the label instructions and dashboard pointer display. General situation is as follows:
1) check the vacuum coating equipment operation control switch in "off" position.
(2) open the total power switch, vacuum coating equipment power.
(3) low pressure valve. Open the charging valve, after hear air flow noise, start up bell valves, bell rises.
(4) fixed tungsten spiral heating installation. The PVDF film and aluminum plate fixed on the rotating disk. Put the aluminium wire wear in the spiral heater element. Clean up each position within the bell jar, ensure that no impurities dirt.
(5) fall in the bell jar.
6. Start the vacuum mechanical pump, vacuum coating equipment.
All landowners compound vacuum gauge power (compound vacuum gauge type: Fzh - 1 a).
A. "1" left knob clockwise rotation to point to the location 2 section of the heat.
B. low vacuum gauge pointer clockwise movement within "2", when the pointer to 110 ma, "1" rotate to the left knob to 2 section measuring position.
Today when the low vacuum gauge pointer within the "2" again moving clockwise to Pa 6.7, into the low pressure valve. "1" then left knob rotation to point 1 section measurement location.
Open cooling water pet-name ruby vacuum coating equipment, start the diffusion pump, heating 40 min.
Attending a low-pressure valve. Repeat all landowners action programs: "1" to point to the lower left knob 2 section measuring position. Low vacuum gauge pointer clockwise movement within "2", when the pointer to Pa 6.7, a high pressure valve (stem clockwise).
Such as low vacuum gauge pointer right within "2" to 0.1 Pa, gauge tube filament switch.
A. launch, zero measurement button "9" rotate to point to launch position.
B. lower left button "1" rotation to point 1 section measurement location.

Analysis Principle vacuum coating equipment

                             Analysis Principle vacuum coating equipment

Principle is the principle of magnetron sputtering vacuum coating equipment , as follows:
Colliding electrons accelerated in the electric field toward the substrate during in and argon atoms, a large number of ionized argon ions and electrons, the electrons onto the substrate. Argon ions accelerated in the electric field bombardment target, a large number of target atoms sputtered, neutral target atoms deposited in a film on the substrate.
Secondary electrons accelerated toward the substrate in the process influenced by the magnetic force of the magnetic field Lorenzi, bound within plasma region near the target surface, a high plasma density region, under the effect of the secondary electrons around the magnetic field the target surface in a circular motion, the motion path of the electrons is very long, constantly in motion the process of collision ionization of argon atoms with a large amount of argon ion bombardment target, after several collisions electron energy decreases, get rid of the shackles of the magnetic field lines , away from the target, eventually deposited on the substrate.
Magnetron sputtering is bound to a magnetic field and to extend the path of movement of electrons, the electrons change the direction of motion, increase the ionization rate of the working gas and the efficient use of energy of the electron vacuum coating apparatus.
Electronic destination just substrates, the vacuum chamber wall and the target source anode is electronic home. But generally the vacuum chamber and the substrate and the anode potential in the same. Interaction between magnetic field and electric field so that a single spiral electron trajectory in three dimensions, and not only in a circular motion in the target surface. As for the type of the target surface sputtering the circumferential contour, and that the magnetic field lines are targets of the circumferential shape of circular. Distribution of magnetic field lines in different directions will film a great relationship.
Coating machine manufacturers said, not only in the interaction mechanism magnetron sputtering magnetic and electric fields of work, multi-arc plated target ion source, a plasma source and so work under this principle. The difference is that the electric field direction, voltage and current magnitude only.

Vacuum coating machines and dynamic magnetic field magnetron sputtering source

             

Motorized vacuum coating magnetic field magnetron sputtering vacuum coating sources, including the target substrate, solder or crimp ring is fixed in front of the target substrate sheet target, shielding ring, magnet board, within the magnet mounted on a magnet board and outside the magnet, the improvements made are: the diameter of the magnet is greater than the radius of the target substrate, and smaller than the diameter of the target, the target substrate magnet axis offset from the axis of the substrate, the substrate magnet fixed gear on a positive side, the coating machine ring gear meshing with the spur gear installed on the rack, the rear side of the installation located spur gear motor, motor power output shaft fixed to the frame turn handle, mounted on the gear shaft turn handle. Motor power output shaft and the ring gear coaxial with the target board settings.

The positive effect of this invention is: get a revolution and rotation of the annular magnetic field to scan to each target position, so that the target in a larger area to be etched shot off evenly. High target utilization, coating uniformity.

A moving magnetic field magnetron sputtering vacuum deposition coater, comprising a vacuum deposition chamber in front of the target substrate, welded or fixed to the sheet-shaped pressure ring positive target target substrate, covering the peripheral side surface of the target substrate and the target substrate positive target shielding material outside of the ring portion, an annular outer magnet disposed in combination target substrate on the back of the magnet substrate, the magnet is mounted on the center position of the magnet toward the substrate and the target substrate side circumferential position or arranged in rings outside the magnet,

Its features are: the diameter is larger than the radius of the target substrate magnet, and smaller than the diameter of the target, the target substrate magnet axis offset from the axis of the substrate, the substrate magnet fixed gear on a positive side, the installation and the coating machine frame ring spur gear, is mounted on the rear side of the spur gear rack located motor, the motor power output shaft fixed turn handle, mounted on the gear shaft turn handle.

magnetron sputtering vacuum coating machine

                     

 Magnetron sputtering vacuum coating machine system is an updated pvd sputtering coating technology with advantages of high sputtering speed, lower temperature, stable performance and simple manipula.
 Operational principle:
Sputtering is physical phenomenon that electron collide with argon atoms and turn into Argon ions and electron ions when electron accelerated flying towards the substrate under the electric field effect. Thereafter, the argon ions accelerated bombard target in the electric field, that will sputter a large number of target atoms, neutral target atoms (or molecules) depositing on the surface of the substrate forming a layer or multi-layers decorative and functional film.
Equipment configuration:
Structure type: vertical type or Horizontal type
Chamber type: single door or double doors
Power type: DC or Mid-frequency
Application field:
It can be widely used in high-grade decorative and functional films for watch, glasses , communications, electronics, machinery, decoration and transportation aviation and other industries.
 Main feature:
1, Higher deposition rate, less temperature rise, better avoid target destroyed and polluted
2, High-energy that released though the sputtering  make the film density and adhesion improved significantly;
3, Touch screen + PLC, to achieve automatic control, automatic / manual switch  anytime;
4, The coating chamber with a high volume, big loading capacity, high production efficiency.
5, The work-piece rotation frame with public structure can be set to automatically reversing, it can ensure the coating uniformity;
6, The whole configuration is reasonable, high pumping rate, low noise, low power consumption;
7, This device deposited film in density, uniformity, purity, hardness, etc. are able to meet customer requirements
Basic Outfit :
1, The coating chamber, valves, pipes are made of stainless steel, vacuum chamber  diameter range from Φ500mm to Φ2000mm ;
2, the vacuum system including:  mechanical pumps, rotary vane pumps, roots pumps and oil diffusion pump with cold trap or molecular pumps;
3, The coating system uses 2 to 10 sets of planar targets or cylindrical targets with 2 to 10 DC or frequency power source;
4, Auxiliary pumping system uses Low temperature steam trap
5,Inflatable system uses 1 to 4 gas flow meter and flow control (display) instrument control;
6, Equipped with Sound and light alarm device for the electronic control system when it happen circuit overload, the shortage of the water, cut-off the gas.
7, The control system (touch screen + PLC) can real-time display detailed parameters, automatic control the entire production process, automatic storage process parameters.
8, The model of the device equipped with high-power systems and ionization source bias assisted deposition coating;
9, Multiple sets of target source for customers choosing.

model	CJ-800	CJ-1000	CJ-1200	CJ-1400	CJ-1600	CJ-1800
Pumping speed	It will take less than 10 minutes from air pump to 9*10-3Pa
Ultimate vacuum	6*10-4Pa
pressure rising rate	0.67Pa/h
target	Cylindrical or planar targets  1----12PCS
Target power	10-----60KW DC or Mid-frequency 1-12sets
bias voltage	10--15KW	20KW	30KW	40KW	40--50KW	60KW
pump	Diffusion pump or molecular pump
Heating	9KW	12KW	15KW	18KW	24KW	36KW
Work frame	It can be customized designed，public rotation，rotation speed can be controlled
gas	Precision meter control 1-4 road work gas
control mode	Manual, semi-automatic and fully automatic control; Control panel use Chinese and English language

 PVD Magnetron Sputtering Coating Machine is a magnetron sputter technology pvd coating machine.
Which widely used in the below application field:
EMI film fo electronics appliance
Metal film for Glass, Ceramics,Mobile phone case,Computuer, PC, PET. etc.
Hard film of hardware and toolings such as TIN, TIALN film.
Watch,glass artwares,Sanitary products,tablewares, knife,crystal products etc.
Coating Film including TIN, TiC, TiCN, TiALN, CrN, Cu, Au, DLC decorative film coating.