The development of the vacuum magnetron sputtering deposition

The development of the vacuum magnetron sputtering deposition
So-called sputtering can be in the charge particles (usually with positive ions of inert gas) to bombard solid surface (hereinafter referred to as the "target"), so as to cause the target material on the surface of the atoms or molecules to escape from it a phenomenon. This phenomenon is glover (Grove) in experimental study in 1842, the cathode corrosion problems, cathode materials have been migrated to the vacuum tube wall. Vacuum coating machine to use this method of sputter deposition film on the substrate was introduced in 1877. Using this approach, however, exist in the early stages of the deposition film sputtering rate is low, film speed is slow, and must be set on high pressure and the device into the inert gas and so on a series of problems. As a result, the slow development of nearly eliminated. Only in the strong chemical activity of precious metals, little metal, get a small amount of medium and compound material application. Until the 1970 s, with the advent of magnetron sputtering in a timely manner, making sputtering deposition has been rapid development, started to go the way of revival.
This is because the magnetron sputtering method by orthogonal electromagnetic field on electronic constraints, increased the probability of electrons collide with gas molecules, such not only reduced on the cathode voltage, and improve the positive ions on target cathode sputtering rate, reduce the probability of the electron bombardment substrate, thus reducing its temperature, namely with the "high speed, low temperature" two big characteristics. In the 80 s, although he appeared just ten years, it will stand out from the lab, truly entered the field of industrial production. And, with the further development of the science and technology, in recent years in the field of sputtering coating introduced ion beam enhanced sputtering, ion source using broad beam intensity flow combined with magnetic field modulation, and combined with the conventional diode sputtering formed a new sputtering mode. And, again will be introduced to the intermediate frequency ac power magnetron sputtering target source. This is called the twin sputtering targets intermediate frequency ac magnetron sputtering technology, not only eliminates the anode effect "disappear". And also solve the problem of cathode "poisoning", which greatly improved the stability of the magnetron sputtering. For large-scale industrialized production of the preparation of compound film provides a solid foundation. Revival and development of coating has rapidly in recent years as people quite a new preparation technology of thin film and active in the field of vacuum coating technology.